Finger-shaped and small heat sinks are designed into applications with a request of above 16K/W thermal resistance. Finger-shaped and small heat sinks have a major advantage due to their design and size, which is saving board space. Active components are directly screwed or bonded onto the heat sink. Finger-shaped and small heat sinks are available based on a horizontal or vertical design. The vertical heat sink design has the further advantage to be equipped optionally with solder pins to stabilize during the assembly process and enable the product to be soldered on the board at the same time. For finger-shaped and small heat sinks different surfaces in tinned or black anodised can be chosen. The ASSMANN WSW components program will be completed by the so called "D Pak heat sinks", which are stamped out of pre-tinned copper instead of the normally used aluminium band material. As a result of the different base material the heat conductivity increases. D-Pak-heat sinks can be used for the reflow soldering process and are available for pick and place handling out of tape & reel packaging.