wafer series SDC connector male SMT | Gold selective Tin pitch 1,27mm 30pin 0,8A
Part number: | A-BBP127-DA-30-GSR1 |
product group: | Wire-to-Board |
version: | wafer |
spacing: | 1.27 mm |
pin count: | 30 |
contact type: | SMT |
current rating: | 0.8 A |
contact direction: | angled (90°) |
style: | male |
plating: | Gold selective Tin |
option model: | SDC connector |
insulator: | LCP UL94V-0 |
Downloads: |
ASSMANN WSW components Inc.
1840 W. Drake Drive, Suite 101
Tempe AZ, 85283, USA
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