Electronic components release an enormous amount of thermal heat, when powered on, heat must be dissipated by using heatsinks. Due to tolerances and surface roughness, the contact surfaces between electronic components and heatsinks contain microscopic unevenness, which results in a heat-insulating air gap. Therefore, the proper thermal conductive material is essential, as the thermal conductive foils equalize these insulating air gaps.

The optimized heat transfer improves the cooling performance of the overall system and thus its service life. The natural properties of silicone ensure optimum adaptation of the heat-conducting foils to the surfaces.

The comprehensive product range of our thermal foils features thermal conductivities up to 15 W/mK for standard foils. The standard product range also includes special foils with thermal conductivities of up to 35 W/mK. In addition to electrically insulating properties, our thermal foils feature the options of higher liability through additional adhesive layers, as well as glass fiber reinforcements for tougher requirements.

ASSMANN WSW provides a broad range of thermal foils as standard portfolio. Benefit on our high vertical range of manufacture to find the right thermal foil for your application. Improve your thermal management to extend the service lifetime of your application.