The easy and time-saving assembly is the advantage of this generation. By pushing the heatsink onto the transistor housing, the cooling fingers form spring clamps which press the transistor housing onto the heatsink. Due to uniform pressure optimal heat transfer will be realised. This series is in different lengths for varied dissipation power suitable and offer at horizontal and vertical installation effective heat emission. For additional fixing on pcb, solder pins in straight and angled version are available. Thermal resistance > 16 K/W is achievable. Due to the narrow version this variation takes less space than any other heat sink. These ASSMANN WSW components heatsinks are used within industrial-, telecom-, consumer- and automotive applications.